Thermal Management

With the drive to package more features into equipment and the need for faster systems with higher throughput capacity / functionality comes an increase in power density. Almost all systems we work on today require some degree of thermal simulation to verify that maximum permissible component temperatures will not be exceeded and often require some level of thermal management in order to improve the thermal performance and provide more acceptable margins.

Our thermal investigations are an integral part of our design process from beginning to end. This starts with an input in the concept phase to ensure that the recommended concept features the appropriate cooling regime and is likely to provide the desired thermal performance. As with mechanical solutions, proposed PCB layout is analyzed and where necessary recommendations made to improve the thermal performance at a component level. PCB geometry may be imported from many leading eCAD (PCB layout) packages to minimize modelling time.

• Specialists in practical cooling of electronics
• Complete Thermal Management solutions: Architecture to implementation
• Empirical methods, Computational Fluid Dynamics (CFD)
• Component / Card / module / System Level analysis
• Transient (time domain) simulations
• Mixed flow analysis
• Implications on reliability, debris filtration and acoustic noise
• Trade-offs with EMC, reliability, cost etc.
• Verification by experimentation where possible